| |
Active
wafer-level optimization of precision linear and mixed-signal
IC devices
|
| |
Provides active trim through integration of laser micro-machining,
probing, & test |
| |
Superior
laser control ensures process consistency & highest
yields
|
| |
Precise
wafer alignment and trim accuracy via Cognex® pattern
recognition
|
| |
Seamless
integration to today’s ATEs via Enhanced Tester Interface |
| |
Reliable,
field-proven product: 100s are in daily production worldwide
|
