WaferMark® CSP200 - Wafer Level Die Marking System

Quality die marking for traceability, product identification and orientation High throughput, producing the industry's highest quality marks Processes background, polished, coated, oxidized, and other surface types Fully automated wafer cassette mapping, wafer transport, alignment, and calibration Integrated mark inspection and validation LightWriter® software with product setup and training wizard Accurately marks die as small as 0.5mm in size