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An
advanced new platform for high precision, high throughput
wafer-level optimization of linear and mixed-signal
IC devices.
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Next generation version of our field-proven M310 WaferTrim™ technology |
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Fully
integrated state-of-the-art Laser Trimmer and Wafer
Prober system
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Seamless
integration to today’s ATEs via GSI Group’s
Enhanced Tester Interface software and real-time
tester interface hardware
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Proven
superior laser control ensures process consistency & highest
yields |
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Advanced vision and motion subsystems
provide dramatically improved positioning and alignment capability
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ANew
user friendly WaferTrim™ software improves efficiency
and provides compatibility with existing M310 data setup
files |
