| |
“Total
solution” system technology to process extremely
tight-pitch fuse structures for exceptional yield enhance-
ment on semiconductor devices, including 90nm and 70nm technology.
|
| |
High-yield
process control capability: ultra stable,
ultra-fine energy setting for accuracy, range, and
resolution – a critical laser redundancy process
requirement for today’s and the next generation of ultra fine pitch links |
| |
Patented
high-speed positioning system optimizes throughput
and enables a 70,000 links/second processing ratee
|
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Precise <0.150µm
(|mean| + 3σ) system
accuracy
|
| |
Minimum
laser spot size of 1.4µm |
