WaferRepair™ M455 - Fuse Processing System


  The first production-proven laser fuse processing system featuring “total solution” system technology to combine a small 0.7μm laser spot size with the beam placement accuracy and stable, precise energy control to enable aggressive fuse pitch shrinks below 1.5μm for 90nm and 70nm designs.
Patented high-speed positioning system optimizes throughput and enables a 70,000 links/second processing rate
Precise <0.150µm (|mean| + 3σ) system accuracy ensures safe, reliable processing
High-yield process control capability: ultra stable,
ultra-fine energy setting for accuracy, range, and
resolution – a critical laser redundancy process
requirement for today’s and the next generation of ultra fine pitch links