If you are committed to fusing and redundancy as a critical part of the IC manufacturing process, the GSI Group family of WaferRepair™ laser systems can provide you with the solutions required.

WaferRepair increases advanced wafer yields to near 100%

With our proprietary laser processes, we cover all fuse link applications, including the latest in copper interconnect technology. Our unique ShapedPulse™ technology processes fuse links at lower energy levels than conventional methods, minimizing potential structural damage and enabling higher repair yield.

Our systems are production proven by industry leaders.

With incredible system accuracy, spot sizes down to 0.7µm, and cut rates in excess of 70,000 links/second, you are assured that we meet the most demanding throughput requirements.

WaferRepair™ Products Include:

• WaferRepair™ M455 - 300mm Fuse Processing System
  - 0.7µm spot size, 70,000 links/second
• WaferRepair™ M450 - 300mm Fuse Processing System
  - 1,4µm spot size, 70,000 links/second
• WaferRepair™ M435 - 300mm Fuse Processing System
  - 1.4µm spot size, 50,000 links second

We are an integral part of our customers’ futures, working closely together to develop next-generation laser fuse processing.