Articles
 |
CircuitTrim
- System Considerations for Laser Trimming Embedded Passives Printed Circuit Design & Manufacture, Apr 2004 |
|
WaferMark
- Laser Marking on Bare Die |
|
CircuitTrim
- Test Aspects of Laser Resistance Trim Reprinted from Productronic, Mar 2004 (text is in German) |
|
WaferMark
- Laser Wafer Marking at Die Level Bo Gu et. al.; Publication for IMAPS North America, Nov 2003. |
|
SVS
- Pre-Reflow, Inline, 3-D Inspection John Weisgerber and Doreen Tan Circuits Assembly, Nov 2003. |
 |
WaferRepair
- Fast Laser Pulse Improves Copper Link Cutting Process Joohan Lee and Joseph Griffiths Semiconductor International web site, Sept 2003. |
|
WaferRepair
- Challenges and Future Directions of Laser
Fuse |
|
SVS
- Boosting First-Pass Yield Stacey Wagner (Kimball Electronics Group) and David Clark Assembly, July 2003. |
|
CircuitTrim
- System Considerations in Production Environment for Laser Trimming of Embedded Passive Components Pierre-Yves Mabboux, Mordechai Brodt, Bo Gu* and Jeff Wake Publication for IPC International Conference on Embedded Passives, June 2003 |
|
WaferRepair
- Analysis of Energy Process Window of Laser |
|
WaferRepair
- Analyzing the Process Window for Laser Copper-Link Processing Joohan Lee, Jonathon S. Ehrmann, Donald V. Smart, Joseph Griffiths, & Joseph B, Berstein; Solid State Technology, Dec 2002. |
|
WaferRepair
- Analysis of Laser Metal Cut Energy Process Window and Improvement of Cut Link Process by Fast Rise Time Laser Pulse Joohan Lee and Joseph J. Griffiths Semiconductor Manufacturing Technology WorkshopHsin Chu, pp 171-174, Dec 2002. |
|
SVS
- Developing SPC Methods for use with AOI Equipment in |
|
WaferRepair
- Energy Effect of Laser-induced Vertical Metallic Link Wei Zhang, Joohan Lee and Joseph B. Bernstein; IEEE Trans. Semiconduct Manufact., vol 14, no. 2, pp. 163-169, May 2001. |
|
WaferTrim
- Laser Trimming: The Competitive Edge in Precision Linear
Devices William Witt Bloomstein, 2001. |
|
SVS
- A 3-D Solder Paste Inspection Strategy for CSPs and 0201s Robert Kelley and Doreen Tan; APEX 2001 Solder Printing Workshop Handout. |
|
SVS
- In-Line Component Placement Inspection: Lowering PCB Assembly Costs with Continuous Quality Improvement Robert Kelley and John Weisgerber; SMT, Feb 2000. |
|
SVS
- 3-D Inspection for the Measurement of Solder Paste Deposits Jeff Rupert, Doreen Tan, and Pat Pilon; APEX 2000 Proceedings. |
|
WaferRepair
- Analysis of Laser Metal-Cut Energy Process Window Joseph B. Bernstein, Joohan Lee, Gang Yang and Tariq A. Dahmas; IEEE Trans. Semiconduct Manufact., vol 13, no.2, pp 228-234, Feb 2000. |
|
SVS
- Pre-reflow Inspection Using 3-D Laser Technology Carl Pollard and Ian McLeod (Ericsson); includes customer testimonial. |
|
SVS
- Specification and Qualification of Machine Vision Technology
in the SMT Process David Clark and Don Rohrer; NEPCON 2000 Proceedings. |