GSI Group Announces New
Laser Fuse Processing System

WILMINGTON, MA, June, 2004 — GSI Group Inc. (Nasdaq: GSLI and TSX: GSI) announces the immediate availability of its next generation WaferRepair™ M435 fuse processing system.

The M435 breaks new ground with the introduction of GSI Group’ DVS™ energy management system, which provides an ultra stable, ultra precise laser energy control architecture necessary for processing fuse designs below 2µm pitch. The M435 also features the industry’s smallest laser spot size of 1.4µm while enabling cuts at a 50,000Hz rate to meet the most demanding production requirements.

According to Tom Coughlin, Product Manager for the company’s fuse processing products, “The M435 combines the system accuracy, small spot size, and throughput performance to address the most critical 90nm and 70nm production requirements.”